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April 2003

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Subject:
Re: BGA Void Acceptability IPC Standard
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Apr 2003 10:27:21 EDT
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One caveat. As the ball pitch gets smaller, the presence of voids become more
critical. As lead-free solders have been shown to be more prone to voiding by
a couple of different studies, this will likely be something to track and
monitor.

Kind regards,
Joe

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