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April 2003

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Subject:
From:
"John S. Grosso" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Apr 2003 08:53:20 -0500
Content-Type:
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text/plain (29 lines)
Process statement:

In our lamination process we use CAC with a .020 aluminum core, no SS
separators for product 8 layers and less. For > 8 layers we use CAC but
with a SS .062 separator between each panel.

Question:

Is anyone having success running straight CAC on > 8 layers? What level of
image transfer are you seeing and on what copper weight? Any issues with
distortion due to dissimilar CTE’s? Any issues with tight dielectric
thickness control? What type of press cycles are being run? What are your
temperature rise profiles? What type of thermal lagging is being used?

Regards,

John S. Grosso

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