Process statement: In our lamination process we use CAC with a .020 aluminum core, no SS separators for product 8 layers and less. For > 8 layers we use CAC but with a SS .062 separator between each panel. Question: Is anyone having success running straight CAC on > 8 layers? What level of image transfer are you seeing and on what copper weight? Any issues with distortion due to dissimilar CTE’s? Any issues with tight dielectric thickness control? What type of press cycles are being run? What are your temperature rise profiles? What type of thermal lagging is being used? Regards, John S. Grosso --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------