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Wed, 7 Feb 2001 16:47:02 EST |
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In a message dated 2/7/01 1:34:16 PM, [log in to unmask] writes:
<< What about the concern of tin whisker growth? I believe that, for some
reason, it isn't an issue with the "white" tin process. >>
Immersion White Tin (IWT) is nonporous, and lacks the grain structure
conducive to tin dedritic growth.
IWT is an immersion process, and arguably more of a coating than a plating.
Electro-deposited tin IS NOT recommended as a solderable finish for a variety
of reasons, including a propensity for "whiskers".
For detailed IWT information look to Florida CirTek (Greely, CO), or the
International Tin Research Institute.
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