In a message dated 2/7/01 1:34:16 PM, [log in to unmask] writes: << What about the concern of tin whisker growth? I believe that, for some reason, it isn't an issue with the "white" tin process. >> Immersion White Tin (IWT) is nonporous, and lacks the grain structure conducive to tin dedritic growth. IWT is an immersion process, and arguably more of a coating than a plating. Electro-deposited tin IS NOT recommended as a solderable finish for a variety of reasons, including a propensity for "whiskers". For detailed IWT information look to Florida CirTek (Greely, CO), or the International Tin Research Institute. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------