Hi out there,
Some causes for this condition, Misregistration between stencil aperture and
the pad, stencil thickness (too much paste applied) stencil snap-off, paste
viscosity, reflow profile all of these things should be checked.
Art Hampton
Process Specialist
-------Original Message-------
From: TechNet E-Mail Forum.; Mark Charlton
Date: Wednesday, March 06, 2002 03:53:51 PM
To: [log in to unmask]
Subject: Re: [TN] Solder fines
Check your raw fabs from the vendor. The only time I experienced this we
traced it back to the vendor's process, probably the HASL end of things.
Mark
-----Original Message-----
From: Bissonnette, Jean-Francois [mailto:[log in to unmask]]
Sent: Wednesday, March 06, 2002 3:50 PM
To: [log in to unmask]
Subject: Solder fines
Hi all,
we have tiny solder balls on assembly manufactured for us. Most of the
little balls
are around SMT leads and are some times numerous. What can cause such
condition?
Jean-François Bissonnette
Vérificateur, Contrôle de la Qualité
Électronique
Produits et Procédés
Vapor Rail Inc.
10655 Henri-Bourassa O.
St-Laurent, Qc
H4S 1A1
(514) 335-4200 x2021
(514) 335-4231 fax
<<Bissonnette, Jean-Francois.vcf>>
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