Hi out there,
Some causes for this condition, Misregistration between stencil
aperture and the pad, stencil thickness (too much paste applied) stencil
snap-off, paste viscosity, reflow profile all of these things should be
checked.
Art Hampton
Process Specialist
-------Original Message-------
Date: Wednesday, March
06, 2002 03:53:51 PM
Subject: Re: [TN]
Solder fines Mark -----Original Message----- From: Bissonnette, Jean-Francois [mailto:[log in to unmask]] Sent: Wednesday, March 06, 2002 3:50 PM To: [log in to unmask] Subject: Solder fines Hi all, we have tiny solder balls on assembly manufactured for us. Most of the little balls are around SMT leads and are some times numerous. What can cause such condition? Jean-François Bissonnette Vérificateur, Contrôle de la Qualité Électronique Produits et Procédés Vapor Rail Inc. 10655 Henri-Bourassa O. St-Laurent, Qc H4S 1A1 (514) 335-4200 x2021 (514) 335-4231 fax <<Bissonnette, Jean-Francois.vcf>> WABTEC CORPORATION CONFIDENTIALITY NOTE The content contained in this e-mail transmission is legally privileged and confidential information intended only for the use of the individual or entity named herein. If the reader of this transmission is not the intended recipient, you are hereby notified that any dissemination, distribution, or copying of this transmission is strictly prohibited. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- . |
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