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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 10 Nov 1998 15:12:07 +1000 |
Content-Type: | text/plain |
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We are considering installing a new convection reflow oven in our PBA
process and would invite comments on reflow capability/comparisons of ovens
designed with HIGH MASS - LOW VOLUME air flow versus LOW MASS - HIGH
VOLUME
air flow.
The PBA's to be reflowed would be printed with No clean Kester R244 solder
paste and populated with components ranging from 50mil pitch large
PLCC/SOIC,
< 402 chip packages, fine pitch devices ranging from QFP/TSOP/SSOP, CBGA
,
PBGA and in the near future uBGA components the first to be considered
will
be 0.75mm pitch.
Regards Evan
Evan Jones
Manufacturing/Test Engineer
Bluegum Technology Pty Ltd
PO Box 609, Wangaratta, Australia, 3676
Ph: 61 3 5720 2539 Fax: 61 3 5720 2412
Internet: [log in to unmask]
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