We are considering installing a new convection reflow oven in our PBA
process and would invite comments on reflow capability/comparisons of ovens
 designed with HIGH MASS - LOW VOLUME air flow versus LOW MASS - HIGH
VOLUME
 air flow.
The PBA's to be reflowed would be printed with No clean Kester R244 solder
paste and populated with components ranging from 50mil pitch large
PLCC/SOIC,
 < 402 chip packages, fine pitch devices ranging from QFP/TSOP/SSOP,  CBGA
,
 PBGA and in the near future uBGA components the first to be considered
will
 be 0.75mm pitch.

Regards Evan

Evan Jones
Manufacturing/Test Engineer
Bluegum Technology Pty Ltd
PO Box 609, Wangaratta, Australia, 3676
Ph: 61 3 5720 2539     Fax: 61 3 5720 2412
Internet:  [log in to unmask]

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