We are considering installing a new convection reflow oven in our PBA process and would invite comments on reflow capability/comparisons of ovens designed with HIGH MASS - LOW VOLUME air flow versus LOW MASS - HIGH VOLUME air flow. The PBA's to be reflowed would be printed with No clean Kester R244 solder paste and populated with components ranging from 50mil pitch large PLCC/SOIC, < 402 chip packages, fine pitch devices ranging from QFP/TSOP/SSOP, CBGA , PBGA and in the near future uBGA components the first to be considered will be 0.75mm pitch. Regards Evan Evan Jones Manufacturing/Test Engineer Bluegum Technology Pty Ltd PO Box 609, Wangaratta, Australia, 3676 Ph: 61 3 5720 2539 Fax: 61 3 5720 2412 Internet: [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################