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April 2002

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Subject:
From:
"WEEKES, MICHAEL HS-SNS" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Apr 2002 13:54:28 -0400
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for a PCB with vias/thru holes

try 140 F with 95% RH for 96 hrs.
then reflow 3 cycles
wave solder
take a look at flow up thru holes/vias

some believe this represents 8 months of shelf life approx.
(from a Mike Carano IPC workshop) - thanks Mike!

Mike Weekes

-----Original Message-----
From: Peter Hefti [mailto:[log in to unmask]]
Sent: Thursday, April 25, 2002 2:30 AM
To: [log in to unmask]
Subject: [TN] Accelerated test for simulation of storage of PCBs with
surface finish white tin



Hello TechNet:

We are searching for a method of accelerated aging of PCBs with surface
finish in white tin (chemical  tin).
This method should be recognized , in order to simulate the storage of 6 or
12 month under normal conditions.
(85/85/1d or 2d  test ??)
After such an accelerated test, the solderability will be tested by the
wetting balance method.

Thank you for your answer

With best regards

Peter Hefti



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