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November 1999

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TechNet <[log in to unmask]>
Subject:
Lead issues
From:
Ed Cosper <[log in to unmask]>
Date:
Mon, 8 Nov 1999 11:12:54 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Ed Cosper <[log in to unmask]>
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Hi all,

I think I've fallen behind on the lead issue. So perhaps some of you can update me a little. I am aware of the environmental ( mostly from Europe ) push to "get the lead out".  I've been watching this with quite some interest as to what board shops are doing and looking into to eliminate the HASL process. However, a recent question was posed to me that I simply couldn't answer.  What is proposed to eliminate the tin/lead at the assembly soldering process? You have to mount ( solder ) all these SMTs and BGAs to the boards with something. I suspect the volume of tin/lead in the aggregate solder joints is significantly higher that what was on the delivered bare board. 


Just curious,

Ed Cosper
ABC

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