Hi all,

I think I've fallen behind on the lead issue. So perhaps some of you can update me a little. I am aware of the environmental ( mostly from Europe ) push to "get the lead out".  I've been watching this with quite some interest as to what board shops are doing and looking into to eliminate the HASL process. However, a recent question was posed to me that I simply couldn't answer.  What is proposed to eliminate the tin/lead at the assembly soldering process? You have to mount ( solder ) all these SMTs and BGAs to the boards with something. I suspect the volume of tin/lead in the aggregate solder joints is significantly higher that what was on the delivered bare board. 


Just curious,

Ed Cosper
ABC