Fellow TechNetters:
Can someone else interpret the stated criteria for section 10.3.2. Figures 10-48 thru 50. Does this criteria solely pertain to PTH/conductor lands or is this also pertain to Surface Mount Pads, J-Leads, Gull Wing, SMT, etc.... I don't see how the industry can permit lifted copper pads from the laminate. Is this criteria for Post soldiering Process or what?
Victor,
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