Fellow TechNetters:

   Can someone else interpret the stated criteria for section 10.3.2.  Figures 10-48 thru 50.   Does this criteria solely pertain to PTH/conductor lands or is this also pertain to Surface Mount Pads, J-Leads, Gull Wing, SMT, etc....   I don't see how the industry can permit lifted copper pads from the laminate.   Is this criteria for Post soldiering Process or what?

Victor,

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________