A major change in test strategy has been propose for our factory and I
am looking for comments addressing pro's and con's. The strategy has
surfaced due to the increased density of late 90's design density and
availability of the higher density, lower inspectable, higher test cost
components and assembly strategies.(BGA's, COB, Chipscale, etc.)
	 The major change is to put a full function x-ray capability (x-ray
Laminography) in front of an in-circuit tester to verify 100 % solder
joint integrity, orientation of part placement, presence of part,
configuration right part, Etc. This will assure that solder integrity
and placement are 100% and greatly reduce defects found down stream at
final LRU acceptance or Burn-In.

	We are:	High Mix 
		Low Volume
		Moderate to High Complexity
		60% Thru Hole, 30% SMT, 10% Mixed Technology


Thanks for your time invested in response	
Semper Fi
Tom   

***************************************************************************
* ChipNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC ChipNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************