A major change in test strategy has been propose for our factory and I am looking for comments addressing pro's and con's. The strategy has surfaced due to the increased density of late 90's design density and availability of the higher density, lower inspectable, higher test cost components and assembly strategies.(BGA's, COB, Chipscale, etc.) The major change is to put a full function x-ray capability (x-ray Laminography) in front of an in-circuit tester to verify 100 % solder joint integrity, orientation of part placement, presence of part, configuration right part, Etc. This will assure that solder integrity and placement are 100% and greatly reduce defects found down stream at final LRU acceptance or Burn-In. We are: High Mix Low Volume Moderate to High Complexity 60% Thru Hole, 30% SMT, 10% Mixed Technology Thanks for your time invested in response Semper Fi Tom *************************************************************************** * ChipNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC ChipNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************