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June 1999

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TechNet <[log in to unmask]>
Subject:
Ball Bonding
From:
Kiet Dang <[log in to unmask]>
Date:
Tue, 29 Jun 1999 13:52:00 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, Kiet Dang <[log in to unmask]>
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     Hello All,
     I'm trying to find the cause for blowing GaAS Ka-Band MMIC power
amplifier
     in our hybrid assembly process. One of the most suspicious process is
auto
     ball bonding, Hughes model 2460-IV. My question is What is the
possibility
     of the EFO from the ball bonder can zap the MMIC?

     Thanks in advance,
     Kiet Dang
     Stellex Microwave System
     [log in to unmask]

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