Hello All, I'm trying to find the cause for blowing GaAS Ka-Band MMIC power amplifier in our hybrid assembly process. One of the most suspicious process is auto ball bonding, Hughes model 2460-IV. My question is What is the possibility of the EFO from the ball bonder can zap the MMIC? Thanks in advance, Kiet Dang Stellex Microwave System [log in to unmask]