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October 1999

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Subject:
Solderball / homeplate / chip
From:
Ramsey's <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Oct 1999 07:03:34 -0400
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text/plain
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text/plain (19 lines) 
Contract Mfg. struggles with solder balls on chip caps.
We can't control the land patterns, but we can change the stencil.
Has anyone out there tried home plate shaped openings in the stencil
even though the lands are rectangular?

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