I an doing the "homeplate" design for all chips,
     (0603, 0805, 1206, 1210) and having great success, I find I do not
     need to do this with tant type caps. on all other parts I just reduce
     the apertures. I currently use Syscon Microscreen for stencils and
     running Alpha UP78 no-clean in an air environment.

     Royce
     **********************************************************
     Royce Taylor
     Sr. SMT Process Engineer
     Hadco Value Added Manufacturing
     10 Manor Parkway
     Salem, NH 03079
     (603)896-2192 voice
     (603)896-2006 fax
     (800)973-4679 pager
     email: [log in to unmask]



______________________________ Reply Separator _________________________________
Subject: [TN] Solderball / homeplate / chip
Author:  "Ramsey's" <[log in to unmask]> at smtplink-hadco
Date:    10/28/99 7:03 AM


Contract Mfg. struggles with solder balls on chip caps.
We can't control the land patterns, but we can change the stencil.
Has anyone out there tried home plate shaped openings in the stencil
even though the lands are rectangular?

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