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October 1999

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TechNet <[log in to unmask]>
Subject:
Solderball / homeplate / chip
From:
Ramsey's <[log in to unmask]>
Date:
Thu, 28 Oct 1999 07:03:34 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, Ramsey's <[log in to unmask]>
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Contract Mfg. struggles with solder balls on chip caps.
We can't control the land patterns, but we can change the stencil.
Has anyone out there tried home plate shaped openings in the stencil
even though the lands are rectangular?

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