If gold touches the solder bath it will continue to be dissolved.
It will not sink to the bottom. There is agitation in the solder pots for
the wave.
A small selective solder pot had 3-4 times the limit of Au for eutectic tin
lead solder.
The site QA team had a nice graph showing the increase in %Au over time but
never told Maintenance or the Process team to fix the pot.
Several members of TN spent some time on this problem and what to do with
the product made.


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