Hi Stephan,

 Could you elaborate on the voiding issue in microbga's ?
 I understand that you have done some x-ray examinations,
 could you tell us what are your pass/fail criteria   as to void size ?.
 Have you find any relation between different solderpaste types to voids?
 What , in your experience, is the assembly parameter that has the major
 contribution for  generating  voids  in bga solder joints ?

 Thanks
 Mickey
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