TECHNET Archives

August 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
Date:
Fri, 13 Aug 1999 13:04:36 EDT
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset="us-ascii"
From:
Mark Dowding <[log in to unmask]>
Parts/Attachments:
text/plain (27 lines)
Yes, the photoresist can make or break the gold plating process.  Most
manufacturers of photoresist make one designed especially for gold, and there
are a variety of good products available.  The entire process, from preclean
prior to resist lamination through gold plating is also critical.  All of the
posts on this subject have excellent advise.

The Hoechst product is, I believe, being sold by Morton as Laminar 5000.
Please feel free to contact me directly if I may be of further assistance.

Mark Dowding
Technical Service Manager
INSULECTRO

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2