Hi,
Does anyone know of criteria for voiding in fine-pitch BGAs after reflow?
IPC-7095 suggests for BGA:
Class I: 60% of dia = 36% of area
Class II: 45% of dia = 20.25% of area
Class III: 30% of dia = 9% of area
Does this apply to fine-pitch components as well? Are there any theories indicating that one can tolerate higher percentage as the balls get smaller?
Thanks,
Hakan Tornqvist
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