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Date: | 22 Oct 96 13:08:53 -0500 |
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We inherited a product line from a closed plant that lead formed a
.600 dip to gull wings using an arbor press. This is not a high
reliability process, mainly due to poor coplanarity. The DIP is then
hand located and either glued or reflowed. Hand placing is acceptable,
due to the extremely large lead spacing of a DIP.
Use a surface mount socket if they must be reflowed, or even better,
purchase them with the proper lead configuration.
______________________________ Reply Separator _________________________________
Subject: Subj: Forming PTH DIPs For SMD
Author: [log in to unmask] at internet
Date: 10/22/96 11:42 AM
Good Day TechNetters!
What experience can you all share about forming through-hole
DIP packages into a surface mount configuration (J-leaded?)
so that the part(s) can be mounted and reflowed during the
SMD operation?
Is there automatic equipment available to form the DIP
leads? If so, who are the manufacturers and what would be a
ballpark cost?
Has reliability testing been done to validate solder joint
integrity?
Is anyone using pick & place equipment to automatically
place the newly formed part(s)?
Ron Hollandsworth
[log in to unmask]
ITT A/CD
Fort Wayne, Indiana
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