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January 2008

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TechNet E-Mail Forum <[log in to unmask]>, Gary Camac <[log in to unmask]>
Date:
Tue, 15 Jan 2008 15:08:53 -0000
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Mike Fenner <[log in to unmask]>
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A quick thought:
If the losses of larger profile components are in the wave it could be due
to the amount of adhesive you can put down with your stencil.
Possibly the print pump technique [from Dek I think, maybe others] could
help here? This is a bit like dispensing paste with a printer and allows
different blob heights from a single pass.


Regards 

Mike Fenner 
Indium Corporation 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Camac
Sent: Tuesday, January 15, 2008 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] Bottom side SMT adhesives

Larry,

You don't say where you are loosing your components.  Handling prior to wave
or at the wave or a combination of both? 

The best smd adhesive I ever ran was an Ashai (sp) product that used to be
sold by Multicore, but it went away when Loctite took them over.  In my
shear tests on this product, I would break the solder mask loose from the
PWB or would break the 1206  test resistor before the smd adhesive bond
would break.  GOOD STUFF - but I have not been able to find it since
Multicore stopping selling it, and believe me I have tried.

Good luck,

Gary Camac   

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Davis, Larry
Sent: Friday, January 11, 2008 11:38 AM
To: [log in to unmask]
Subject: [TN] Bottom side SMT adhesives

Happy Friday Everyone!

We are currently stencil printing Loctite 3612 for our bottom side SMT
parts.  We have trouble getting larger parts (SOL's, tantalums, etc) to stay
attached consistently.  I'm just wondering what products others are using
for this process and if anyone has had the same issue.

Thanks and have a great weekend!

Larry


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