A quick thought: If the losses of larger profile components are in the wave it could be due to the amount of adhesive you can put down with your stencil. Possibly the print pump technique [from Dek I think, maybe others] could help here? This is a bit like dispensing paste with a printer and allows different blob heights from a single pass. Regards Mike Fenner Indium Corporation -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Camac Sent: Tuesday, January 15, 2008 1:01 PM To: [log in to unmask] Subject: Re: [TN] Bottom side SMT adhesives Larry, You don't say where you are loosing your components. Handling prior to wave or at the wave or a combination of both? The best smd adhesive I ever ran was an Ashai (sp) product that used to be sold by Multicore, but it went away when Loctite took them over. In my shear tests on this product, I would break the solder mask loose from the PWB or would break the 1206 test resistor before the smd adhesive bond would break. GOOD STUFF - but I have not been able to find it since Multicore stopping selling it, and believe me I have tried. Good luck, Gary Camac -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Davis, Larry Sent: Friday, January 11, 2008 11:38 AM To: [log in to unmask] Subject: [TN] Bottom side SMT adhesives Happy Friday Everyone! We are currently stencil printing Loctite 3612 for our bottom side SMT parts. We have trouble getting larger parts (SOL's, tantalums, etc) to stay attached consistently. I'm just wondering what products others are using for this process and if anyone has had the same issue. Thanks and have a great weekend! Larry This message (including any attachments) contains confidential and/or proprietary information intended only for the addressee. 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