 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uVzgU-0000C9C; Tue, 18 Jun 96 07:15 CDT |
| Content-Type: |
text/plain; charset="US-ASCII" |
| Old-Return-Path: |
|
| Date: |
Tue, 18 Jun 96 13:56:29 +0100 |
| Precedence: |
list |
| Reply-To: |
|
| Resent-Sender: |
|
| Content-Transfer-Encoding: |
7bit |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| X-Status: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| Resent-From: |
|
| Resent-Message-ID: |
<"iariJ1.0.yd6.5tfnn"@ipc> |
| Mime-Version: |
1.0 |
| Content-Description: |
<A:\IPC\TERMAL.TXT> |
| Subject: |
|
| From: |
|
| Content-Id: |
<9_45_1_835120604> |
| From [log in to unmask] Tue Jun 18 09: |
03:22 1996 |
| X-Mailer: |
Ultimedia Mail/2 Lite, IBM T. J. Watson Research Center |
| Message-Id: |
<9606182057.AA0010@localhost> |
| Parts/Attachments: |
|
|
We are investigating the feasibility of a software tool to predict
the reflow soldering profile. As input we want amount and type of
components, print parameters (thickness, layers, area etc.). As output:
conveyor speed, the different temperatures and convection % for our
hot air reflow machine.
Does anybody know tools that can accomplish this? If not, are you
interested in the results or do you just want that bright and shiny
solder joints (target condition class 3)?
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Ivo de Rooij (off-line) Manufacturing Process Engineer SMT/THT
@ __ __ @ @ ______
_|________ _|__|_|__|_| _____|_______| ____ |___
| // | | | // | | | || // || |
===| _____ o.|====| |________|o|==========| o. _______ ||____|| _ |===
| ________ | | ________ | |___._| | |_______| | | _ |
||________|| |_|________|_| | | |_____________|______|___|
|| || || || | | || || || ||
Fokker Elmo BV Electric and Electronic Aerospace Systems
[log in to unmask] [log in to unmask]
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~.
|
|
|
