We are investigating the feasibility of a software tool to predict the reflow soldering profile. As input we want amount and type of components, print parameters (thickness, layers, area etc.). As output: conveyor speed, the different temperatures and convection % for our hot air reflow machine. Does anybody know tools that can accomplish this? If not, are you interested in the results or do you just want that bright and shiny solder joints (target condition class 3)? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Ivo de Rooij (off-line) Manufacturing Process Engineer SMT/THT @ __ __ @ @ ______ _|________ _|__|_|__|_| _____|_______| ____ |___ | // | | | // | | | || // || | ===| _____ o.|====| |________|o|==========| o. _______ ||____|| _ |=== | ________ | | ________ | |___._| | |_______| | | _ | ||________|| |_|________|_| | | |_____________|______|___| || || || || | | || || || || Fokker Elmo BV Electric and Electronic Aerospace Systems [log in to unmask] [log in to unmask] ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~.