ENIG is a viable surface finish for lead free, data was presented at the LF
conference on the solder joint reliability of this finish with SA 305 alloy.
DIG direct immersion gold is the direct deposition of 2 micro-inches of gold
on copper.
Of course Immersion silver, immersion Tin and OSP are equally viable.
A unique surface finish that gave the most reliable solder joint with SAC
305 alloy was ENEPIG electroless Ni electroless Pd with Immersion Gold.
Best regards
George Milad
[log in to unmask]
National Accounts Manager for Technology
Uyemura International Corporation
Technical Center
240 Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860) 793-4011 (office)
(860) 793-4020 (fax)
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