ENIG is a viable surface finish for lead free, data was presented at the LF conference on the solder joint reliability of this finish with SA 305 alloy. DIG direct immersion gold is the direct deposition of 2 micro-inches of gold on copper. Of course Immersion silver, immersion Tin and OSP are equally viable. A unique surface finish that gave the most reliable solder joint with SAC 305 alloy was ENEPIG electroless Ni electroless Pd with Immersion Gold. Best regards George Milad [log in to unmask] National Accounts Manager for Technology Uyemura International Corporation Technical Center 240 Town LIne Rd Southington CT 06489 (516) 901 3874 (mobile) (860) 793-4011 (office) (860) 793-4020 (fax) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------