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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 20 Apr 1999 22:51:22 -0500 |
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Hi Kent - In terms of solderability requirements you could use
ANSIJ-STD-002A as your specification. Do you know what the metallization on
the resistors is? There are several different test methods within the
specification that can be used (Take a look and if you have additional
questions just shoot me an email). Good Luck.
Dave Hillman
JSTD-002A committee cochair
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"Kent S. Asmus" <[log in to unmask]> on 04/17/99 01:44:43 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to "Kent S. Asmus" <[log in to unmask]>
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cc:
Subject: [TN] SMT Chip Resistors
All-
When sourcing precision thick-film SMT chip resistors with wrap-around
contacts, how does one typically control the quality of the delivered
product; i.e., contact solderability, contact integrity, etc? In other
words, what is the industry standard specification(s) that are typically
called out for such components? What is the appropriate IPC or EIA
standard?
I am also interested in finding out what tests can be conducted to
determine
the solderability of wrap-around contacts on SMT chip resistors.
I'm currently experiencing contact dewetting during reflow on about 20% of
the resistors obtained from a particular manufacturer. There also appears
to
be a significant number of chips with cracks in the wrap-around contacts.
Thanks in advance for any information you may be able to provide.
Regards,
Kent
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