Good morning all,

Paragraph 7.4 of J-STD-001 states, "The manufacturer shall develop and maintain operating
procedures describing the reflow soldering process and the proper operation of the
equipment.  These procedures shall include, as a minimum, a reproducible time/temperature
envelope including the flux and solder paste application procedures and coverage,
drying/outgassing operation (when required) preheating operation (when required),
controlled atmosphere (if used), solder reflow operation, and cooling operation."

Could someone elaborate on  "a reproducible time/temperature envelope".  I am unsure on
this. It is the same wording as revision B, so I looked for clarification,
unsuccessfully,  in IPC-HDBK-001 rev. B.  Are we talking just oven parameters?  I think
not because all the subsequent clauses describe the whole SMD process, except for
placement.  I am thinking it is the process window that is dictated by the characteristics
of the paste being used and the factory environment.  I am sure all you guys running Class
3 have got one of these , right?

Thanks for any assistance,

Gary Camac