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From [log in to unmask] Sat Apr 27 15: |
13:21 1996 |
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The appearance of the palladium plated lead IC solder joints continues
to create anxieties with our customers. This occurs because they see
a solder connection profile which is different than would result from
a pb/sn plated lead connection. Texas Instruments has published a
booklet demonstrating and discussing the differences, but this is not
completely sufficient to convince some of our customers.
Is there any 'work in progress' material available from IPC and/or
other sources which can be used to graphically educate auditors and
customers about acceptable appearances of palladium plated lead solder
joints? Now our auditors and customers reference the IPC-A-610 Rev. B
manual.
Thank you.
Myron Papiz
MSL
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