The appearance of the palladium plated lead IC solder joints continues to create anxieties with our customers. This occurs because they see a solder connection profile which is different than would result from a pb/sn plated lead connection. Texas Instruments has published a booklet demonstrating and discussing the differences, but this is not completely sufficient to convince some of our customers. Is there any 'work in progress' material available from IPC and/or other sources which can be used to graphically educate auditors and customers about acceptable appearances of palladium plated lead solder joints? Now our auditors and customers reference the IPC-A-610 Rev. B manual. Thank you. Myron Papiz MSL