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Date: | Tue, 28 Mar 2006 10:30:33 -0500 |
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Currently using a Phillips part,
http://www.semiconductors.philips.com/pip/NE57814DD.html
This is a standard SO8 package with a large "heat slug pad" under the part.
During reflow the part is floating off center and causing shorts to the
lead pads.
I believe this because of the the volume of paste in the heat slug area
is lifting the
part up and surface tensions take over.
I have a call into tech support at Phillips, but I figured I would query
while waiting for a call back.
What is the recommended volume of solder paste under this device ?
What is the recommended solder mask opening(s) under this device?
- Something like 4-6 smaller opening over a continuous top side
ground plane?
What is the recommended paste printing pattern under this device?
- match the soldermask openings?
Does anyone have experience with such a device?
Thanks,
Dave
--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560
Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297
[log in to unmask]
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