Currently using a Phillips part, http://www.semiconductors.philips.com/pip/NE57814DD.html This is a standard SO8 package with a large "heat slug pad" under the part. During reflow the part is floating off center and causing shorts to the lead pads. I believe this because of the the volume of paste in the heat slug area is lifting the part up and surface tensions take over. I have a call into tech support at Phillips, but I figured I would query while waiting for a call back. What is the recommended volume of solder paste under this device ? What is the recommended solder mask opening(s) under this device? - Something like 4-6 smaller opening over a continuous top side ground plane? What is the recommended paste printing pattern under this device? - match the soldermask openings? Does anyone have experience with such a device? Thanks, Dave -- Dave Seymour, CID+ Catapult Communications Inc. 800 Perimeter Park Dr, Suite A Morrisville, NC 27560 Direct: (919)653-4249 Main: (919)653-4180 Fax: (919)653-4297 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------