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October 1999

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Subject:
Re: Solder float thermal shocks.
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Oct 1999 16:22:27 EDT
Content-Type:
text/plain
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text/plain (26 lines) 
In a message dated 10/08/99 15:05:56, [log in to unmask] writes:
>Hi Werner
>I guess I come from the bare board view and not those solder joint views.
>Yes, I can appreciate the differences, but I don't think the 2.6.8 thermal
>stress test would be performed on an assembly.
>Susan
Hi Susan,
No, you sure wouldn't; but we should try to keep our language and definitions
as consistent as possible--there is enough confusion even without adding
terminology as a variable.
Werner

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