In a message dated 10/08/99 15:05:56, [log in to unmask] writes: >Hi Werner >I guess I come from the bare board view and not those solder joint views. >Yes, I can appreciate the differences, but I don't think the 2.6.8 thermal >stress test would be performed on an assembly. >Susan Hi Susan, No, you sure wouldn't; but we should try to keep our language and definitions as consistent as possible--there is enough confusion even without adding terminology as a variable. Werner ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################