TECHNET Archives

April 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Subject:
Solder filled vias
From:
Nick Nicolaides <[log in to unmask]>
Date:
Mon, 5 Apr 1999 17:16:20 -0400
Content-Type:
text/plain
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Nick Nicolaides <[log in to unmask]>
Parts/Attachments:
text/plain (22 lines) 
        Recently one of our PCB houses has shipped boards with the VIAS
filled with
        solder. Generally per IPC600, it states that VIAS other than blind
or buried
        can be solder masked or solder (coated). Since this area is quiet in
the IPC
        or J-Standards, what is your take on this. In addition on the same
boards we
        see both solder mask and solder filled.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2