Recently one of our PCB houses has shipped boards with the VIAS
filled with
        solder. Generally per IPC600, it states that VIAS other than blind
or buried
        can be solder masked or solder (coated). Since this area is quiet in
the IPC
        or J-Standards, what is your take on this. In addition on the same
boards we
        see both solder mask and solder filled.

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