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August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
Re: BGA Solder Ball Migration
From:
"Yuen, Mike" <[log in to unmask]>
Date:
Fri, 29 Aug 1997 16:13:00 CDT
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, "Yuen, Mike" <[log in to unmask]>
Parts/Attachments:
text/plain (11 lines) 
* EXCESSIVE SOLDER:- SOLDER BALL TOUCHING EACH OTHER
* EXCESSIVE PRESSURE ON THE BGA PART
* POPCORNING OF COMPONENT
* INCORRECT BALL PAD DESIGNS

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From: owner-technet
To: TechNet
Subject: [TECHNET] BGA Solder Ball Migration

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