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id m0uldNk-0000NcC; Wed, 31 Jul 96 10:40 CDT |
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Wed, 31 Jul 1996 10:50:23 -0500 |
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| From [log in to unmask] Wed Jul 31 17: |
27:02 1996 |
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Novell GroupWise 4.1 |
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We are preparing to purchase a GPD CF-15 component prepping
machine. This machine uses a roller method to form leads.
The die set for 0.040" to 0.060" dia. leads forms the lead with a
radius of 0.045". This radius is less than what is specified in IPC-A-610B
section 3.3, Table 3.3. The machine vendor has told our MFG Engineer
that this is the way "many" assembly houses prep components. I am
concerned on the reliablility of prepping to such a tight radius on the large
lead.
Does anyone have experience with this type of machine relating
to IPC specified bend radius values? We can prep to Class 2 with the
exception of several large lead diameter parts. I would handle this case
with a statement that would exclude the large lead parts.
Thanks for any information provided.
Rick Vernon, QA Engineer, Phoenix International Corp.
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