We are preparing to purchase a GPD CF-15 component prepping machine. This machine uses a roller method to form leads. The die set for 0.040" to 0.060" dia. leads forms the lead with a radius of 0.045". This radius is less than what is specified in IPC-A-610B section 3.3, Table 3.3. The machine vendor has told our MFG Engineer that this is the way "many" assembly houses prep components. I am concerned on the reliablility of prepping to such a tight radius on the large lead. Does anyone have experience with this type of machine relating to IPC specified bend radius values? We can prep to Class 2 with the exception of several large lead diameter parts. I would handle this case with a statement that would exclude the large lead parts. Thanks for any information provided. Rick Vernon, QA Engineer, Phoenix International Corp. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************