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Tue, 20 Mar 2018 15:39:36 -0400 |
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how about use dummy components as process development and minimize
the X-ray inspection time (programming). (used to do RAM wirebond
inspection years ago, after the inspection process/MFG process
optimized, you limited X-ray exposure time to minimum... 5-10 device
per min if my memory serve me right and you get a "golden part -
dummy" for set up intensity and resolution, position)...
On Mar 20, 2018, at 11:50 AM, Guy Ramsey wrote:
> Anyone have experience with AXI damaging devices like embedded SSD,
> mosfets, or programmed memory devices?
> We are seeing lower than normal yields at test. Our assembly
> processes seem
> well controlled. So, we were brainstorming for places that might
> deserve
> closer evaluation.
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