how about use dummy components as process development and minimize the X-ray inspection time (programming). (used to do RAM wirebond inspection years ago, after the inspection process/MFG process optimized, you limited X-ray exposure time to minimum... 5-10 device per min if my memory serve me right and you get a "golden part - dummy" for set up intensity and resolution, position)... On Mar 20, 2018, at 11:50 AM, Guy Ramsey wrote: > Anyone have experience with AXI damaging devices like embedded SSD, > mosfets, or programmed memory devices? > We are seeing lower than normal yields at test. Our assembly > processes seem > well controlled. So, we were brainstorming for places that might > deserve > closer evaluation.