how about use dummy components as process development and minimize  
the X-ray inspection time (programming).  (used to do RAM wirebond  
inspection years ago, after the inspection process/MFG process  
optimized, you limited X-ray exposure time to minimum... 5-10 device  
per min if my memory serve me right and you get a "golden part -  
dummy" for set up intensity and resolution, position)...
On Mar 20, 2018, at 11:50 AM, Guy Ramsey wrote:

> Anyone have experience with AXI damaging devices like embedded SSD,
> mosfets, or programmed memory devices?
> We are seeing lower than normal yields at test. Our assembly  
> processes seem
> well controlled. So, we were brainstorming for places that might  
> deserve
> closer evaluation.