There are three basic types of rigid-flex product.  The oldest 
versions use acrylic adhesive constructions to bond the copper to the 
flex layers and have always struggled with the thermal mismatch of 
the materials.  With the advent of adhesiveless laminates, the 
technology became more robust.  Both of these technologies are 
available from any of the manufacturers of rigid-flex.  These 
include, but are not limited to, Parlex, Dynaco, Teledyne, EMC, 
Strataflex, Pioneer, Multiflex and FCI.  I've tried to list them all.

The problem with rigid-flex has always been cost.  Functionality is 
outstanding, but the commercial world can't afford the cost.  Several 
technologies are available that are trying to make R/F practical for 
commercial applications.  Teledyne came out with the first, 
Regal-Flex and that technology is avaible through GulTech, Hadco and 
Teledyne.  Parlex then developed the PALCore process, which uses 
resin coated copper cap layers to build thin and low cost boards, and 
still holds that technology exclusively.  EMC had their own process 
also and now Hadco has announced their HVR product that is similar to 
Regal-Flex.  

If you contact Hadco, Parlex, Teledyne and EMC, you will have access 
to information on the key and different rigid flex technologies on 
the market.

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