There are three basic types of rigid-flex product. The oldest versions use acrylic adhesive constructions to bond the copper to the flex layers and have always struggled with the thermal mismatch of the materials. With the advent of adhesiveless laminates, the technology became more robust. Both of these technologies are available from any of the manufacturers of rigid-flex. These include, but are not limited to, Parlex, Dynaco, Teledyne, EMC, Strataflex, Pioneer, Multiflex and FCI. I've tried to list them all. The problem with rigid-flex has always been cost. Functionality is outstanding, but the commercial world can't afford the cost. Several technologies are available that are trying to make R/F practical for commercial applications. Teledyne came out with the first, Regal-Flex and that technology is avaible through GulTech, Hadco and Teledyne. Parlex then developed the PALCore process, which uses resin coated copper cap layers to build thin and low cost boards, and still holds that technology exclusively. EMC had their own process also and now Hadco has announced their HVR product that is similar to Regal-Flex. If you contact Hadco, Parlex, Teledyne and EMC, you will have access to information on the key and different rigid flex technologies on the market. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************