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Topic: Surface moisture affecting operational amplifier output
drift on a FR-4 multi-layer PCB.
(board layup) - 1). component layer, 2). ground plane, 3).
power plane, 4). solder side layer
Question: When shielding the input pins of an operational
amplifier with guard rings, is it recommended to
expose the guard traces (solder over tin reflow), rather than
covering them with solder mask ?
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